crushing machine for silicon wafer in mylar

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    value (for a mylar thickness of 80um and desired cut into the mylar of 20um) would be 60um (80 60) or 0.060mm. thickness. programmed value will be the total of your sample thickness and the thickness of the material that the sample is mounted on ( blue mylar of glass plate or si wafer) for example if the mylar is 80 microns and your sample is 300 microns, thickness. would be equal to 380um.

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